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Information
Voltage Regulator of SMD
SOT-89 (Power mini mold) MP-3Z (SC-63)
Document No. G11872EJ3V0IF00 (3rd edition) Date Published March 2000 N CP(K)
(c)
Printed in Japan
2000
[MEMO]
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Information G11872EJ3V0IF00
* The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98. 8
Information G11872EJ3V0IF00
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Regional Information
Some information contained in this document may vary from country to country. Before using any NEC product in your application, pIease contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify:
* * * * *
Device availability Ordering information Product release schedule Availability of related technical literature Development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, AC supply voltages, and so forth) Network requirements
*
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country.
NEC Electronics Inc. (U.S.)
Santa Clara, California Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288
NEC Electronics (Germany) GmbH
Benelux Office Eindhoven, The Netherlands Tel: 040-2445845 Fax: 040-2444580
NEC Electronics Hong Kong Ltd.
Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044
NEC Electronics Hong Kong Ltd. NEC Electronics (France) S.A.
Velizy-Villacoublay, France Tel: 01-30-67 58 00 Fax: 01-30-67 58 99 Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411
NEC Electronics (Germany) GmbH
Duesseldorf, Germany Tel: 0211-65 03 02 Fax: 0211-65 03 490
NEC Electronics (France) S.A. NEC Electronics (UK) Ltd.
Milton Keynes, UK Tel: 01908-691-133 Fax: 01908-670-290 Spain Office Madrid, Spain Tel: 91-504-2787 Fax: 91-504-2860
NEC Electronics Singapore Pte. Ltd.
United Square, Singapore 1130 Tel: 65-253-8311 Fax: 65-250-3583
NEC Electronics Taiwan Ltd. NEC Electronics Italiana s.r.l.
Milano, Italy Tel: 02-66 75 41 Fax: 02-66 75 42 99
NEC Electronics (Germany) GmbH
Scandinavia Office Taeby, Sweden Tel: 08-63 80 820 Fax: 08-63 80 388
Taipei, Taiwan Tel: 02-2719-2377 Fax: 02-2719-5951
NEC do Brasil S.A.
Electron Devices Division Rodovia Presidente Dutra, Km 214 07210-902-Guarulhos-SP Brasil Tel: 55-11-6465-6810 Fax: 55-11-6465-6829
J99.1
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Information G11872EJ3V0IF00
1. INTRODUCTION
In recent years electronic devices such as camcorders, notebook PCs, and cellular telephones, have been increasingly miniaturized. In response, the need for smaller and lighter semiconductor devices and electronic components employed for these systems to increase the mounting density on PC boards has intensified. NEC offers SOT-89 and MP-3Z surface-mount packages for power supply ICs. This document explains the characteristics and taping specifications of the SOT-89 and MP-3Z packages.
2. DIMENSIONS
Figure 1 shows the dimensions of the SOT-89 package, and Figure 2 shows the dimensions of the MP-3Z package. Figure 1. SOT-89 Dimensions (unit: mm)
4.50.1 1.60.2
1.50.1
0.8 MIN.
0.42 0.06
0.47 1.5 0.06 3.0
0.420.06 0.41+0.03 -0.05
Figure 2. MP-3Z Dimensions (unit: mm)
6.50.2 5.00.2
1.5 -0.1
+0.2
4.00.25
2.30.2 0.50.1 0.8
0.5 1.0 MIN. 1.5 TYP.
4
4.3 MAX.
5.50.2
1
2
3
2.0 MIN.
0.8
1.10.2 2.3 2.3
0.9 MAX.
10.0 MAX.
2.50.1
0.8 MAX.
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3. CHARACTERISTICS
Because of the construction, the SOT-89 and MP-3Z packages change their thermal characteristics, i.e., total power dissipation, depending on the material and area of the PC board on which the packages are to be mounted. The Data Sheet for a power IC housed in the SOT-89 package shows the total power dissipation when the package is mounted on a ceramic PC board. mounted on a glass epoxy board. Figures 4 and 5 show the typical mounting pad dimensions. The recommended soldering conditions are described in the Data Sheet of each product. Be sure to read this description. Figure 3. Size of Glass Epoxy Board and Total Power Dissipation of SOT-89 Figure 3 shows the total power dissipation when the package is
10
Total power dissipation PT (W)
Board with Cu electrode on total surface (electrode thickness: 35 m) 1
Board without Cu electrode
0.1 100
1000
10000
100000
Glass epoxy board area S (mm2)
10
Board size 50 mm x 50 mm x 1.6 mm Cu electrode area: A
50 mm
Total power dissipation PT (W)
Collector electrode of transistor is connected to Cu electrode of the board (35 m thick). 50 mm Collector electrode of transistor is connected to Cu electrode of the board (18 m thick).
1
Emitter electrode of transistor is connected to Cu electrode of the board Transistor electrode are not connected to Cu electrodes. Ratio of Cu electrode area to board area 0.1 0 10 100 Board Cu electrode area A (mm2) 1000 10000 1% 5% 10 % 50 % 100 %
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Information G11872EJ3V0IF00
Figure 4. SOT-89 Typical Mounting Pad Dimensions (unit: mm)
2.2 45
0.9
45
1.0 1.5
1.0 1.5
1.0
Figure 5. MP-3Z Typical Mounting Pad Dimensions (unit: mm)
7.0
1.5 2.3 2.3
1.5
2.0
2.0
7.0
1.5
0.9
2.2
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4. TAPING SPECIFICATIONS
The SOT-89 and MP-3Z packages can be delivered on a tape like other ICs. Figures 6 and 7 show the tape shape and dimensions. Figures 8 and 9 show the reel shape. Figure 6. SOT-89 Tape Dimensions (12 mm embossed-type carrier tape)
t

H A J G
E D
B
K0 K1 K F
W
C
Unit: mm
Item Recessed hole for component insertion Height Width Depth Pitch Feeding hole Diameter Pitch Position Distance between center lines Cover tape Carrier tape Vertical Horizontal Width Width Thickness Hole depth Device Inclination Total thickness Symbol A B K0 F J H E G D W C t K1 Dimensions, Angle
+0.1 5.0-0.1 +0.1 4.6-0.1
Remark Inner side of edge on surface 0.5 mm above inner bottom Inner side of edge on surface 0.5 mm above inner bottom Internal space Total error:
+0.1 MAX./10 -0.3
1.80.1 8.00.1
+0.1 1.5-0.05
pitch
4.00.1 1.50.1 2.00.05 5.650.05
+0.3 9.5 -0
Total error:
+0.1 -0.3 MAX./10
pitch
Distance between edge of tape and center of hole Center line of recessed hole and feeding hole Center line of recessed hole and feeding hole Thickness: 0.1 MAX. Warp 0.3 MAX.
120.2 0.30.05 2.10.1 30 MAX. 2.150.1
K
Total of cover tape and carrier tape
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Information G11872EJ3V0IF00
Figure 7 (A). MP-3Z Tape Dimensions (16 mm embossed-type taping) Unit: mm
P0
E
Symbol
Standard 7.1 MAX. 10.7 MAX.
P2
D0
T
W
A B D0
1.5-0
F
+0.1
B
D1 E
1.5 MIN.
1.750.1 7.50.1 4.00.1 8.00.1 2.00.1 0.2 2.70.1 16.00.3
D1 P1 A T T2
F P0 P1 P2 T T2 W
Figure 7 (B). MP-3Z Tape Dimensions (32 mm adhesive-type taping) Unit: mm
D (12 Pitch) C
Symbol A Standard 32 -0.4 260.1 4.00.1 480.3 120.1
+0
d
d
2-H
I G B A
B C D E
J
F G
1.0 -0
+0.1
E t2t1
F MP-3Z
6.00.2 R2.0 8.0 4.0 0.15 0.18 00.5
H I J t2 t1 d
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Figure 8. SOT-89 Reel Dimensions Unit: mm
Symbol
1
Dimensions, Angle
C
B A
Figure 9 (A). MP-3Z Reel Dimensions (embossed-type taping) Unit: mm
Symbol A
1
2
A W B
1782
130.5
601
90
1
C
130.5
120
2
W
Standard 329 100 130.5 210.8 2.00.5 2 8 16.4 -0 (2.5) 22.4 MAX. 260 1.0 120 60
+2.0
F 3-r D
B C
C
1
V
D
B A
K
E
E
2
F V W W1
W1 W1 W W2
W2 K r
1 2
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Information G11872EJ3V0IF00
Figure 9 (B). MP-3Z Reel Dimensions (adhesive-type taping) Unit: mm
Symbol Dimensions, Angle
A B
C B A
300 80 15.5
34 2 381
C W t
t W F t
F
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The direction of a taped product is as shown in Figures 10 and 11. The part number of a taped product, including the symbol indicating the direction, is as follows: Note The part number of the taped product of the SOT-89 package differs from those of discrete devices such as transistors and diodes. Figure 10. SOT-89 Taping Direction
"-E1" Draw-out direction
"-E2"
Figure 11. MP-3Z Taping Direction (A) Embossed-type taping
"-E1" Draw-out direction
"-E2"
(B) Adhesive-type taping
"-T1" Draw-out direction
"-T2"
PCxxxxxT
-
Part number on Data Sheet
Type and direction of taping
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Information G11872EJ3V0IF00
Table 1 shows the number of packages on a tape. Table 1. Number of Packages per Tape
Package SOT-89 MP-3Z (embossed taping) MP-3Z (adhesive taping) 1000 2000 1500 Quantity (units/reel)
Information G11872EJ3V0IF00
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Information G11872EJ3V0IF00
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North America Hong Kong, Philippines, Oceania NEC Electronics Inc. NEC Electronics Hong Kong Ltd. Corporate Communications Dept. Fax: +852-2886-9022/9044 Fax: 1-800-729-9288 1-408-588-6130 Korea Europe NEC Electronics Hong Kong Ltd. NEC Electronics (Europe) GmbH Seoul Branch Technical Documentation Dept. Fax: 02-528-4411 Fax: +49-211-6503-274 South America NEC do Brasil S.A. Fax: +55-11-6465-6829 Taiwan NEC Electronics Taiwan Ltd. Fax: 02-2719-5951 Asian Nations except Philippines NEC Electronics Singapore Pte. Ltd. Fax: +65-250-3583
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